The Chinese Institute of Engineers (CIE) established the Industry–Academia Collaboration Excellence Award in 2007 to recognize public and private organizations as well as academic institutions that have demonstrated outstanding contributions to industry–academia collaboration. Leveraging a series of highly impactful collaborative achievements, the Institute for Information Industry (III) distinguished itself among numerous contenders, earning first place, the highest honor, in the 2025 Industry–Academia Collaboration Excellence Award—Enterprise Category (Public and Private Organizations).
In addition, I-Heng Meng, Director General of Software Technology Institute (STI) at III, was bestowed the 2025 CIE Outstanding Engineer Award, in recognition of his long-standing and significant contributions to the sectors such as intelligent transportation systems, artificial intelligence, software engineering, and AI governance. At the award ceremony held on June 6th , STI Director General Meng accepted the awards on behalf of III. Following the ceremony, Chun-I Fan, President of III was received by Ching-Te Lai, President of Taiwan, who personally extended his congratulations and recognition.
Amid an increasingly competitive and rapidly evolving market environment, while forward-looking R&D remains essential, the ability to translate technology into real-world applications and tangible value often hinges on robust industry–academia collaboration. In this spirit, III has long served as a bridge between industrial demand and academic expertise, developing diverse collaboration models. The six award-winning projects (see note) span areas including AI talent development, clinical medical technologies, wireless communications, disaster prevention and monitoring applications, smart manufacturing, and semiconductor practical validation. Together, they underscore III’s strength in tightly integrating academic research with industrial practice—not only strengthening Taiwan’s technological foundations but also enhancing industrial competitiveness and international impact.
Chun-I Fan, President of III noted that III has consistently focused on bridging technology and talent by integrating resources across industry, government, academia, and research to foster a practice-oriented innovation ecosystem. The recognition of these six projects, he pointed out, highlights the III team’s sustained efforts in cross-disciplinary collaboration, talent cultivation, and technology commercialization. Looking ahead, III will continue to deepen industry–academia collaboration, working alongside industry and academic partners to build a globally competitive ecosystem for talent and technology.
I-Heng Meng, STI Director General at III, Honored with the 2025 Chinese Institute of Engineers (CIE) Outstanding Engineer Award, Leading Innovation in AI and Digital Transformation
With more than 30 years of experience in information and communications technology (ICT) and software R&D, I-Heng Meng, Director General of Software Technology Institute at III, has long been dedicated to advancing Taiwan’s industrial software capabilities. Under his leadership, III-led teams have garnered 14 major international awards, including the R&D 100 Awards, Edison Awards, WITSA Awards, APICTA Awards, and the AI Excellence Awards, underscoring Taiwan’s technological strength and global competitiveness. Among these achievements, III’s AI-powered traffic safety protection technology has been deployed across nine cities and counties across Taiwan, covering more than 200 critical intersections and reducing traffic accident rates by 39 percent. The solution was further recognized as a 2024 R&D 100 Award winner.
Beyond these accomplishments, Director General Meng has been a strong advocate for automotive software standardization, spearheading the establishment of Taiwan’s first vehicle software testing and validation laboratory, the Formosa Automobility Intelligence Trustworthy Hub (FAiTH). The initiative promotes the transition toward Software-Defined Vehicles (SDV) and helps shift Taiwan’s automotive electronics industry from a hardware-centric model to one that integrates software innovation, while aligning local industries with international standards. In the area of AI governance, Director General Meng has driven the launch of the AI 133 Lab and the Smart Pole Interoperability Laboratory, establishing robust verification frameworks to enhance the trustworthiness and sustainability of AI applications.
He has also practively advanced corporate social responsibility, applying smart transportation technologies to improve safety in rural areas and on school campuses. Notable initiatives include the deployment of Hand-Crank Powered LoRa Smart Bus Stops in Jian-Shi Township, Hsin-Chu County, and the installation of Motorcycle V2I (Vehicle-to-Infrastructure) Systems on campuses, demonstrating the positive societal impact of technology.
This award not only represents a high-level recognition of Mr. I-Heng Meng’s personal achievements, but also highlights III’s ongoing commitment to driving industrial upgrading through technological innovation. Looking ahead, III will continue to advance its core mission of leveraging technological innovation to accelerate industrial transformation, promoting the adoption of key technologies, deepening industry–academia collaboration, and assisting Taiwan's industries to accelerate upgrading as they move toward a digitally enabled and sustainable future.
Note: Highlights of the Six Award-Winning Projects
1. Enterprise Talent Development and Training Data Governance Ecosystem—Powered by Generative AI
In collaboration with National Cheng Kung University, Soochow University, and several other academic institutions, this initiative establishes a standardized AI curriculum spanning senior high schools to higher education. By integrating expert mentorship and international exchange mechanisms, the program comprehensively strengthens educational innovation and the application of generative AI, cultivating the next generation of critical digital talent.
2. Advanced Practical Program for True Wireless Bluetooth Earbud Chip and System Design
Working with National Yang Ming Chiao Tung University and industry experts from MediaTek, the program enables students to engage in hands-on implementation and research on BT 6.X Bluetooth technologies. The initiative bridges the gap between academic learning and practical application, enhancing capabilities in Bluetooth chip design and R&D.
3. Clinical Application and Integration of a Lightweight Motion Capture System
Developed in partnership with National Yang Ming Chiao Tung University, this markerless motion capture system overcomes the limitations of traditional approaches and has been successfully deployed in medical rehabilitation and neurological disease diagnostics. The system achieves 95 percent accuracy at one-tenth the cost of conventional solutions, advancing the accessibility and adoption of clinical technologies.
4. Semiconductor Industry General Competency Certification Program
In collaboration with National Kaohsiung University of Science and Technology, Ming-Hsin University of Science and Technology, and other institutions, this program establishes a standardized semiconductor competency certification framework and hands-on testing facilities. In 2024, the pass rate reached 85 percent, and the certification has been aligned with industry recruitment systems, becoming a key reference for talent selection in the semiconductor sector.
5. Exploration and Research on Resilient Edge AI Applications
Partnering with Feng Chia University, this project introduces lightweight AI-based image recognition to develop an automated rockfall monitoring system. The solution enhances real-time responsiveness and accuracy, setting a new benchmark for intelligent disaster prevention.
6. AI-Native O-RAN Reconfigurable Intelligent Surface (RIS) Technology Research
Jointly developed with National Chung Cheng University, this project advances next-generation 6G-oriented O-RAN RIS control technologies integrated with AI algorithms. The research strengthens wireless communication performance and lays the groundwork for future self-learning and intelligent network management systems.