2025.03.20

Breakthroughs Expected in AI and Semiconductor Cybersecurity III and DEKRA Forge Strategic Partnership

III News
Dr. Po-Jen Hsiao (right), Vice President of the Institute for Information Industry (III), and Rubén Lirio (left), Global Head of Cybersecurity Services at DEKRA Group, signed a Memorandum of Strategic Cooperation on behalf of their respective organizations on 20th March.
Dr. Po-Jen Hsiao (right), Vice President of the Institute for Information Industry (III), and Rubén Lirio (left), Global Head of Cybersecurity Services at DEKRA Group, signed a Memorandum of Strategic Cooperation on behalf of their respective organizations on 20th March.
The Institute for Information Industry (III), DEKRA Group, and its subsidiary Onward Security signed a Memorandum of Cooperation on 20th March. Pictured after the signing ceremony are (from left): Daniel Liu, Senior Associate Manager at Onward Security; Morgan Hung, General Manager of Onward Security; Rubén Lirio, Global Head of Cybersecurity Services at DEKRA Group; Po-Jen Hsiao, Vice President of III; Mars Kao, Deputy Director General of III CyberSecurity Technology Institute; and Song-Kong Chong, Chief of III Artificial Intelligence Innovation Institute.
The Institute for Information Industry (III), DEKRA Group, and its subsidiary Onward Security signed a Memorandum of Cooperation on 20th March. Pictured after the signing ceremony are (from left): Daniel Liu, Senior Associate Manager at Onward Security; Morgan Hung, General Manager of Onward Security; Rubén Lirio, Global Head of Cybersecurity Services at DEKRA Group; Po-Jen Hsiao, Vice President of III; Mars Kao, Deputy Director General of III CyberSecurity Technology Institute; and Song-Kong Chong, Chief of III Artificial Intelligence Innovation Institute.



The Institute for Information Industry (III) and DEKRA Group, along with its subsidiary Onward Security, officially signed a Memorandum of Strategic Cooperation today (20th), marking a major step forward in advancing cybersecurity certification for AI and the semiconductor industry. The partnership aims to drive technological innovation, strengthen industry compliance capabilities, and cultivate cybersecurity talent in Taiwan to meet the rapidly evolving demands of the market.



Both parties will co-develop AI evaluation and verification tools, establish a cybersecurity assessment and certification lab tailored for the semiconductor sector, and launch training programs focused on cybersecurity of advanced chips so as to enhance the industry’s ability to deal with cybersecurity threats. The two units will collectively promote the adoption of international security standards in AI and semiconductor technologies, while also cultivating skilled professionals for the demand coming from the industry.



Since 2024, the Institute for Information Industry (III) and DEKRA have been proactively collaborating to build an ecosystem of digital trust and security. The signing of this Memorandum of Understanding (MOU) deepens the partnership between the two sides, expanding their joint efforts from smart mobility safety to AI security and chip cybersecurity certification. This strengthened alliance aims to enhance Taiwan’s global competitiveness in the fields of AI and semiconductor cybersecurity.



Dr. Po-Jen Hsiao, Vice President of the Institute for Information Industry (III), who represented III at the signing, emphasized that in the fields of AI and semiconductor cybersecurity, international collaboration and alignment with global standards are essential for maintaining Taiwan’s competitive edge in the global supply chain.“We are pleased to join hands with DEKRA Group to strengthen Taiwan’s cybersecurity capabilities in the AI and semiconductor sectors,” Hsiao said. “By leveraging our combined strengths, we aim to inject new momentum into Taiwan’s AI and semiconductor industries, collectively safeguard cybersecurity, and create indispensable value.”



To advance security and compliance in the chip industry, the Artificial Intelligence Innovation Institute (AIII) of the Institute for Information Industry will support the development of AI-powered tools designed for compliance assessment of chip security technical documents. By introducing AI models, the tools will be able to quickly analyze discrepancies between chip technical documents and international standards—such as SESIP and Common Criteria—identify potential technical gaps and risks, and generate consistent, efficient evaluation reports. This initiative not only enhances the overall efficiency of the verification process, but also helps reduce human errors and reinforces the industry’s expectations for chip security and reliability. The collaboration aims to establish a next-generation AI-driven tool for evaluating and verifying chip technical document compliance, enabling companies to identify risks early in the product development cycle and significantly shorten the time required for product certification.



In this collaboration, the CyberSecurity Technology Institute (CTI) of the Institute for Information Industry (III) also plays a key role. CTI Director General Dr. Jung-San Lee noted that CTI operates the only domestic laboratory in Taiwan with chip security testing capabilities and has extensive experience in secure chip development. DEKRA, on the other hand, brings strong international expertise in chip security consulting and testing. Looking ahead, both parties will focus on technological innovation and professional training so as to build a more secure semiconductor ecosystem. Furthermore, the two units aim to advance Taiwan’s chip security technologies and strengthen the nation’s strategic position in the global chip supply chain—laying the foundation for a safer future for Taiwan’s chip industry.



Rubén Lirio, Global Head of Cybersecurity Services at DEKRA Group, emphasized, “With the rapid development of AI and semiconductor technologies, ensuring the security and reliability of these innovative technologies is more critical than ever. This collaboration enables us to establish dedicated cybersecurity testing and certification frameworks for AI chips and systems, ensuring compliance with the highest international standards and meeting the demands of the global market.”



Morgan Hung, General Manager of Onward Security, added, “As cybersecurity threats continue to escalate, talent cultivation has become a top priority. Through comprehensive training programs, we aim to enhance the industry’s cybersecurity resilience and ensure that enterprises are well-prepared to face future challenges.”This collaboration not only strengthens Taiwan’s competitiveness in the AI and semiconductor sectors, but also sets a new benchmark for security and innovation in the global tech industry—ensuring that as the industry evolves rapidly, it also keeps higher cybersecurity standards in place.



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